HomeTest SocketsBurn-In SocketsContactLinks

ChipTest Associates

 

Plastronics, Inc.  burn-in test sockets feature:

  • Wide range of selection including BGA, QFN/CSP, QFP, LCC, PLCC, SO, SOJ, and SSOP.
  • Largest selection of burn-in sockets for QFN leadless devices. 
  • Largest selection in the industry of sockets for BGA and CSP devices.
  • The original inventor of the open-top surface-mount device socket and the open-top ball grid array socket, Plastronics designs all new products in-house.
  • Short lead times with many socket configurations delivered in 2-3 weeks.
   Plastronics H-Pin Spring Probes for Burn-In and Test

New! - Plastronics H-Pin Insert Sockets

Combines superior performance H-Pin contacts with off the shelf molded socket components providing excellent cost/performance for test and burn-in applications.

 

Manufacturers
Representative

 
Using a cam handle or rocker (for automated loading / unloading), Plastronics' open-top BGA sockets provide true True Zero Insertion Force (ZIF) Socket (ZIF) loading. All contact forces, regardless of solder ball count, are contained within the socket and are not transferred to the burn-in board. This eliminates bowing and concurrent difficulty in contacting solder balls.

To make the BGA open-top sockets as cost-effective as possible, Plastronics utilizes a system of "clip-in" guide plates on the top surface of the socket. This enables the socket to accept virtually any size package, of the same pitch, that is equal to or smaller than the maximum allowable package size. Custom "clip-in" guide plates are manufactured for a minimal fee in a short amount of time, eliminating the high tooling charges of a separate socket for each individual package.
Plastronics now offers 0.5 mm, 0.65 mm, .75 mm, and 0.8 mm pitch test and burn-in sockets for fine pitch BGA and CSP packages. Witness marks on tested packages show excellent contact with the small solder balls associated with CSP packages while maintaining no deformation on the lower 50% of the solder ball.
Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.

SPECIFICATIONS (mm):

• Available in .40, .50, .65, .80 and 1.00 mm pitches
• Custom pitches down to .30 mm
• Lidded and Open Top Sockets for 3 mm - 10 mm packages
• Lidded Sockets for 10 - 16 mm packages
• Center ground pin standard for all sockets
• Optional copper heat slug available for high wattage devices
• Sockets for over 80 different JEDEC standard footprints
LGA Sockets
  • Automated or manual loading
  • Timely delivery
  • Cost-effective tooling for custom packages
  • Surface mountable sockets are also available
 

Ph: (408) 772-6062